- pcb007 Magazine
Latest IssuesCurrent Issue
The Registration Sweet Spot
Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
- Events||| MENU
- pcb007 Magazine
Review of the 2017 IPC Reliability ForumJuly 18, 2017 | Steve Williams
Estimated reading time: 1 minute
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
The event steering committee charged with developing the forum was headed by Program Chair Michael Carano, and included Don Dupriest, Michael Jawitz, Craig Hillman, Gary Ferrari, Jack Fisher, Denny Fritz, and Sanjay Huprikar, VP of the IPC Member Services. Mike Carano, VP of RPB Chemical Technologies, served as the forum’s ringleader, host and emcee. I was fortunate enough to have been asked to participate and speak at the event, and I feel an obligation to let those who were not able to attend this year know what an invaluable educational opportunity this ongoing forum presents for our industry moving forward.
The forum was well attended, with a veritable who’s who of our industry’s supply chain, including raw material and equipment suppliers, PCB fabricators, contract manufacturers and OEMs. Companies represented included: Amphenol, Atotech, Aurora Circuits, CTS, DfR Solutions, Dow Chemical, Dow Electronic Material, DuPont–RTP, Embraer S.A., Extreme Engineering Solutions, FTG Circuits, HDP User Group International, Holaday Circuits, Intrinsiq Materials, Inventec Performance Chemicals, IPC, KEMET Electronics, Lockheed Martin Space Systems, Lockheed Missiles and Fire Control, MacDermid Enthone, MED-EL, Minco, Motorola, Nexteer Automotive, Northrop Grumman, NSWC Crane, NTS, Orbital, Park Electrochemical, Penn State University, Precision Analytical Laboratory, Prismview, Raytheon, RBP Chemical Technology, Rockwell Collins, RollsRoyce, SAIC, Summit Interconnect, The Right Approach Consulting, ThingWeaver Solutions, TTM Technologies, Ventec, and ZESTRON.
The Steering Committee did a wonderful job of assembling a lineup of topics that were both relevant to the forum’s theme of manufacturing high-performance products, and presenting insight from our industry’s brightest technological minds. What follows is a brief highlight of each speaker’s presentation.
To read the full version of this article which appeared in the July 2017 issue of The PCB Magazine, click here.
Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.
SEMI announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next generation of leaders.
For this month's PCBAA Member Profile, the focus is on Hari Pillai, president, Technology Components, Sanmina. Hari says, "I think I’ve had a good dose of luck throughout my career. But beyond luck, I had a vision to become a general manager as far back as my undergraduate years. I made all my career decisions based on that. My evaluation criteria was always, “How does this opportunity get me closer to my goal?” Sometimes opportunities come from unexpected places."
American Standard Circuits to Exhibit at the 60th Annual Association of Old Crows International Symposium and Convention 202312/05/2023 | American Standard Circuits
West Chicago, Illinois-based PCB fabricator American Standard Circuits will be exhibiting at this year’s Annual Association of Old Crows International Symposium to be held from December 11 through the 13th in National Harbor, Maryland.
Mycronic AB has received an order for an SLX mask writer from a new customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the first quarter of 2025.