-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Review of the 2017 IPC Reliability Forum
July 18, 2017 | Steve WilliamsEstimated reading time: 1 minute

IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
Event Background
The event steering committee charged with developing the forum was headed by Program Chair Michael Carano, and included Don Dupriest, Michael Jawitz, Craig Hillman, Gary Ferrari, Jack Fisher, Denny Fritz, and Sanjay Huprikar, VP of the IPC Member Services. Mike Carano, VP of RPB Chemical Technologies, served as the forum’s ringleader, host and emcee. I was fortunate enough to have been asked to participate and speak at the event, and I feel an obligation to let those who were not able to attend this year know what an invaluable educational opportunity this ongoing forum presents for our industry moving forward.
The Audience
The forum was well attended, with a veritable who’s who of our industry’s supply chain, including raw material and equipment suppliers, PCB fabricators, contract manufacturers and OEMs. Companies represented included: Amphenol, Atotech, Aurora Circuits, CTS, DfR Solutions, Dow Chemical, Dow Electronic Material, DuPont–RTP, Embraer S.A., Extreme Engineering Solutions, FTG Circuits, HDP User Group International, Holaday Circuits, Intrinsiq Materials, Inventec Performance Chemicals, IPC, KEMET Electronics, Lockheed Martin Space Systems, Lockheed Missiles and Fire Control, MacDermid Enthone, MED-EL, Minco, Motorola, Nexteer Automotive, Northrop Grumman, NSWC Crane, NTS, Orbital, Park Electrochemical, Penn State University, Precision Analytical Laboratory, Prismview, Raytheon, RBP Chemical Technology, Rockwell Collins, RollsRoyce, SAIC, Summit Interconnect, The Right Approach Consulting, ThingWeaver Solutions, TTM Technologies, Ventec, and ZESTRON.
The Topics
The Steering Committee did a wonderful job of assembling a lineup of topics that were both relevant to the forum’s theme of manufacturing high-performance products, and presenting insight from our industry’s brightest technological minds. What follows is a brief highlight of each speaker’s presentation.
To read the full version of this article which appeared in the July 2017 issue of The PCB Magazine, click here.
Suggested Items
SIA Applauds Passage of Strengthened Semiconductor Investment Credit
07/04/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer following passage in the U.S. House of Representatives of the One Big Beautiful Bill Act (H.R. 1).
Horizon Sales Celebrates 10 Years of Exceptional Service by Sales Leader David Smith
07/02/2025 | Horizon SalesHorizon Sales, a premier manufacturers’ representative and distributor for the electronics assembly industry, is proud to announce that David Smith is celebrating 10 years with the company this month.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
06/24/2025 | Mike Konrad -- Column: The Knowledge BaseAs the electronics manufacturing industry races to meet rising global demand and technological complexity, the need for a highly skilled, future-ready workforce has never been greater. At the forefront of addressing this challenge is The Electronics Manufacturing & Assembly Collaborative (EMAC)—a national initiative dedicated to strengthening the talent pipeline through strategic collaboration with SMTA, education, and government stakeholders.