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Indium to Feature Ultra-Low Voiding Solder Paste at SMTAI 2017
July 27, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its ultra-low voiding Indium10.1HF solder paste—which helps customers avoid the void—at the SMTA International Technical Conference, to be held September 17–21, 2017, in Rosemont, Illinois.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.
The flux chemistry is specifically engineered to improve reliability with:
- High ECM performance under low standoff components
- Outstanding solder beading
- Very low bridging, slump, and solder balling
- Resistance to head-in-pillow
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.
For more information about Indium Corporation’s low-voiding solder pastes, click here or see Indium Corporation at Booth 517.
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