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TRI to Showcase PCBA Inspection Solutions at NEPCON Japan 2018November 29, 2017 | TRI
Estimated reading time: 2 minutes
Test Research Inc. (TRI) will join NEPCON Japan 2018, which will be held at the Tokyo Big Sight, to showcase its Industry 4.0 inspection solution, YMS 4.0, along with its complete PCBA manufacturing inspection solutions. TRI will be at Booth #E33-4.
"The PCBA manufacturing industry has never been so close to experience the full Industry 4.0 Solutions. Visit TRI during NEPCON Japan to experience TRI's YMS 4.0 solution and discover the benefits of real time M2M communication for centralized inspection," said Jim Lin, TRI's VP of sales and marketing.
Machine to machine (M2M) Communication is the data transmission between devices, sensors and other machines. M2M communication enables the collection of Big Data between different sources. The processing of this data facilitates fully automated real time process control for Smart Factories with production analysis, defect image linkage and SPC trend monitoring capabilities. M2M communication is key for the Industry 4.0 development.
The highlights of TRI's portfolio will include the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI. Built with CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing. TRI will also present the TR7700Q 3D AOI with Depth from Focus (DFF) module and stop-and-go technology to optimize the inspection of complex PCBs, delivering high speed, high accuracy and high reliability testing.
Depth from Focus
Depth of Focus (DFF) is a revolutionary 3D sensing technique that searches for the optimal focus position and measures the depth of the image. The DFF algorithm will create 3D model of the component and its surroundings.
Discover how TRI's complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Our experts will demonstrate the advantages of TRI's Industry 4.0- ready smart inspection software and our high performance hardware design can bring to your production.
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.
Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
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At this year's productronica, the world's leading trade show for electronics manufacturing, ULT will present a brand new extraction solution for solder fumes and vapor.