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IPC APEX EXPO Boosts Uyemura's ENIG/ENEPIG Development
March 26, 2018 | UyemuraEstimated reading time: 1 minute
Uyemura, the preeminent manufacturer of advanced chemistries for PCB manufacturing, received a significant boost for its two most important recent product developments at IPC APEX EXPO this year. This, according to UIC Business Development Manager Rich DePoto.
“UIC’s ENIG has clearly earned its place as the industry’s standard for mid-phos electroless nickel with an immersion gold topcoat,” said DePoto.
UIC ENIG is a cost-effective process that provides exceptional gold thickness uniformity; it is also an exceptional soldering and contacting final finish. Most notably, the product’s low corrosion formulation meets the guidelines of IPC 4552, Rev. A – a substantial competitive advantage that was widely discussed among the 4169 attendees – and 449 exhibitors – who participated in APEX this year.
Uyemura’s second major focus at IPC this year was ENEPIG 2.0, now widely regarded as the advancement that propels ENEPIG onto OEM specifications – and into widespread general acceptance.
The key to the success of both systems is an important technology development, TWX-40, the world’s first mixed-reaction autocatalytic gold. This unique reaction facilitates gold deposits up to 8 µin in a single step.
The standard ENIG gold deposit thickness has been 1.6 to 3 µin, but a number of OEMs want to specify thicker gold. Designers are often looking for a minimum 3-5 µin gold in order to widen their operating window and assure success in wire bonding and repeat contact applications.
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