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Koh Young to Demo 3D Inspection at SMT Hybrid Packaging 2018
May 14, 2018 | Koh Young TechnologyEstimated reading time: 2 minutes
Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.
Latest AOI System
At the show, Koh Young will demonstrate its Zenith2 3D AOI, which inspects a wide range of components with side-view camera solutions. The next-generation 3D AOI platform in the Zenith series, the Zenith2 recently earned SMT China VISION Award for its innovation. This user-friendly, smart 3D AOI was designed with Industry 4.0 in mind. Some new features include AI-powered Auto Programming, which automatically configures inspection conditions and yields a 70 percent reduction in programming time and OPO@KSMART (Offline Program Optimizer) to automatically define and deploy modified inspection conditions without interrupting production.
3D SPI with Auto-Repair
Koh Young will also display its enhanced 3D SPI system with an innovative integrated solder paste dispensing function called Auto-Repair. The high-precision, user-friendly dispensing system helps to eliminate costly mistakes from insufficient solder that contributes to open joints, lean fillets, and weak joints. While the KY8030-3 inspects solder paste with the highest possible speed and precision, it can now repair insufficient solder defects before leaving the machine. With this new feature, manufacturers realize an enhanced first pass yield and reduced operational costs.
New Pin Inspection System
Leveraging its strength in robotics and 3D measurement, Koh Young will also highlight the new KY-P3 inspection solution. The Koh Young KY-P3 allows manufacturers to measure and inspect a wide range of pins, including single pin, press-fit, fork-pin, and connectors. Using 3D measurement, the KY-P3 ensures the pins are correctly aligned for the designated through-hole openings in the circuit board. Thanks to Koh Young’s superior 3D imaging technology, the system measures with ±0.75% pin height accuracy.
As the absolute leader in the SPI and AOI market, you can visit Koh Young at Booth 233 in hall 4A.
About Koh Young Technology, Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communication with its growing customer base, while providing them with access to a global network of process experts.
For more information, click here.
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