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Rogers to Show RF/Microwave Materials for Autonomous Vehicles, 5G Apps at IMS2018May 21, 2018 | Rogers Corporation
Estimated reading time: 5 minutes
Rogers Corporation will be showing samples of its extensive portfolio of high-performance circuit materials at this year’s 2018 IEEE Microwave Theory & Techniques (MTT-S) International Microwave Symposium (IMS). The IMS event is the RF/microwave industry’s largest gathering of electrical engineering professionals and features technical conferences, workshops, and a vast exhibition area where visitors can see and learn more about the industry’s latest products and technologies. The full 2018 IEEE IMS (www.ims2018.org) event, including conference and exhibition, is set for June 10-15, 2018 at the Pennsylvania Convention Center in Philadelphia, PA, with the exhibition scheduled for June 12-14, 2018.
Rogers Corporation (at booth 939) will be part of this large exhibition event, presenting circuit materials from its Advanced Connectivity Solutions business unit. These materials support a wide range of applications such as vehicular thermal management and Advanced Driver Assistance Systems (ADAS) at millimeter-wave (mm-Wave) frequencies of 24 and 76 through 81 GHz, Internet of Things (IoT) devices for connected small homes and offices, PCB antennas for communications and radar systems, and backhaul radios for present and future wireless communications networks.
RO4835T/RO4835 Laminates, RO4450T Bonding Materials & CU4000/CU4000 LoPro Foils
RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. RO4450T Bonding Materials are 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials that were designed to complement RO4835T and the existing RO4000 laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses. CU4000 and CU4000 LoPro Foils are sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.
RO4835T laminates and RO4450T bonding materials exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bonding materials have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
CLTE-MW laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or electrical constraints. The seven available thickness options from 3 mils to 10 mils ensure that ideal signal to ground spacing exists for today’s 5G and other millimeter wave designs. In addition, a variety of copper foil options are available including rolled, reverse treated ED, and standard ED. Resistive foil and metal plate options are also available upon request.
CLTE-MW laminates are reinforced with spread glass, which along with a high filler loading help minimize the high frequency glass weave effects on electromagnetic wave propagation. The woven glass reinforcement also provides excellent dimensional stability. Other key features of the laminate include low z-axis CTE (30ppm/°C) for excellent plated through hole reliability, a low loss tangent of 0.0015 at 10 GHz to enable low loss designs, and low moisture absorption of 0.03% to ensure stable performance in a range of operating environments. Thermal conductivity of 0.42 W/(m.K) enables heat dissipation in aggressive designs along with a high dielectric strength of 630 V/mil to ensure good z-axis insulation between conductor layers. The UL 94 V-0 flammability rating enables the use of CLTE-MW laminates in commercial applications.
CLTE-MW laminates are well suited for a range of applications including Amplifiers, Antennas, Baluns, Couplers and Filters. Applicable markets range from Commercial and Consumer to Defense and Aerospace.
Xtreme Speed RO1200 High Speed, Extremely Low Loss Laminates
As the demand for faster and more data drives channel speeds of core network infrastructure beyond 50 Gbps, one of the limiting factors in increasing performance is the signal attenuation resulting from the circuit materials.
Network equipment designers need high performance circuit materials with superior electrical properties for applications like IP Infrastructure, High Performance Computing, and Test and Measurement. Xtreme Speed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. Rogers XtremeSpeed RO1200 circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.
With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10GHz, RO1200 laminates provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, RO1200 laminates are well suited for the most demanding high layer count applications.
AD300D Antenna Grade Laminates
AD300D fourth generation, commercial microwave and RF laminate material extends the capabilities of the successful AD300™ product grade. This ceramic-filled,glass-reinforced, PTFE based material provides the controlled dielectric constant (2.94±0.05), low loss performance (0.0021 at 10GHz), very good passive intermodulation response (-159dBc at 0.030” thickness), and good circuit processability required for mobile infrastructure microstrip antenna applications.
IM Series Antenna Grade Laminates:
The IM Serieshigh frequencylaminatesarean outstanding Passive Intermodulation (PIM) performing version of our AD300D, AD255C, and DiClad 880 antenna grade laminates. The PIM performance of all substrates with the IM cladding has typical values of -166dBc at 0.030” and -165dBc at -060” using the Rogers internal test method of two43dBmswepttonesat1900MHz.
Visitors to the 2018 IMS exhibition floor can learn more about these and other materials for electronic design at Rogers’ booth 939. Designers of high-power systems, such as communications radio transmitters and radar systems, for example, can find out about materials with high thermal conductivity for use in thermal management applications, whether in digital, power, or microwave circuits.
Rogers’ John Coonrod to Deliver Two Presentations at IMS
As part of the MicroApps program, Rogers’ Technical Marketing Manager John Coonrod will make two presentations:
Tues., June 12 at 1:45– “Material and Circuit Influences for PIM-Related Issues”
Thurs., June 14 at 11:00– “The Impact of PTH Via’s on PCB RF Performance”
About Rogers Corporation
Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.
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At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.