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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Updated Program for EIPC 50th Anniversary Conf Now Available
May 22, 2018 | EIPCEstimated reading time: 1 minute
The past, the present and the future—these the three elements of EIPC’s 50th anniversary conference being held in Dusseldorf in June this year. Half a century has passed since EIPC was founded in the days when the PCB was more than just a commodity.
At the upcoming conference to be held in Dusseldorf, Germany, there will be a first-class show on June 21–22, with the conference on Day 1 culminating with a visit to Unimicron’s new multilayer factory in Geldern, the Tate Modern of the European PCB industry. This will be followed by a celebration dinner at the 14th Century listed and moated Walbeck Castle.
Day 1 will be the occasion in which Paul Waldner looks back over 50 years in the industry, while Hans Friedrichkreit unveils his metric crystal ball to compete with the imperial one that Walt Custer usually produces. From then on, there will be a wealth of technological discussions on topics such as traceability, PCB 4.0, and halogen-free laminates.
Day 2 is dedicated to flex for 5G, curved and stretchable PCBs, open-source language, organic surface preservatives, and lab-on-PCB technology, as well as the traditional glimpses into developments in applications, chemistries and supply chain management.
For the updated detailed conference program, click here.
For the conference registration form, click here.
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Best Technical Paper Awards Showcased at APEX EXPO 2026
03/02/2026 | Global Electronics AssociationThe Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.