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In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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Candor is Breaking Boundaries with Flex-Core Boards
June 11, 2018 | Candor IndustriesEstimated reading time: 1 minute
Candor Industries has successfully manufactured 0.5-mil flex-core boards with 0.5-oz copper and 4-mil plated vias.
Sunny Patel, Candor’s technical sales manager, remarked about the accomplishment, "We are pushing the limits on our flex manufacturing, going for much thinner substrates and different material stiffeners."
Thinner material processing allows for better real estate savings for Candor’s flex customers when fitting into smaller packaging. By working together with Candor, developing these types of prototypes will allow for faster lead times with better cost savings down the road.
"Customers need hard, but thin, materials in thin core applications. We’ve found that stainless steel is a good fit for this and we can easily provide this service in-house using our unique flex processing,” said Patel.
Conventional board shops may have trouble getting tooling holes in stainless without CNC subcontracting. Due to their continual investments in the needs of their customers, Candor is able to provide detailed cutting of stainless sheets in-house.
About Candor Industries
Since 1999, Candor Industries has provided 21st Century customers with innovative PCB solutions for complex technologies through a commitment to service and support. Limitations created by standard manufacturing methods led Candor to invent and develop certain technological advancements, helping them to emerge in the forefront as a top of the line solutions provider. Candor continues to push the envelope of PCB manufacturing through continuous R&D, helping both customers and the industry to a brighter future. For more information about Candor, click here.
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Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.