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STI Earns Recertification to IPC J-STD-001 and IPC-A-610
July 2, 2018 | STI Electronics, Inc.Estimated reading time: 1 minute
STI Electronics Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, announces the recertification as a Qualified Manufacturer to IPC J-STD-001 and IPC-A-610.
To earn this recertification, STI successfully completed an intensive audit based on IPC's standards, including IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies. The company also completed an audit on the Space and Military Applications Electronic Hardware Addendum to J-STD-001, a standard focused on soldering requirements for hardware manufactured for space and military applications.
STI met or exceeded the electronics industry’s Class 3 testing requirements, which are intended for high-performance electronics assemblies. As a result, the company continues to be listed as an IPC-trusted source capable of manufacturing in accordance with industry best practices. STI and other trusted sources of supply can be found on IPC's QML/QPL (Qualified Product Listing) database.
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.
About STI Electronics, Inc.
Since 1982, STI Electronics, Inc. (STI) has been the premier full-service organization for training, consulting, laboratory analysis, prototyping, and small-to-medium volume contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. For more information, click here.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    