-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson SELECT Launches Automatic Solder Nozzle Tinning System
July 18, 2018 | Nordson SELECTEstimated reading time: 2 minutes
Nordson SELECT, a Nordson company, announces its automatic solder nozzle tinning system is available for all Nordson SELECT selective soldering machines which is compatible with lead-free and tin-lead solder alloys.
Other selective soldering machines incorporate various types of automatic solder nozzle cleaning to minimize machine downtime by eliminating manual nozzle cleaning. These different methods include ultrasonic nozzle cleaning, spraying or brushing the solder nozzle with adipic acid or organic acid, or spraying a liquid or powdered flux directly onto the outer surface of the solder nozzle. While these methods clean the solder nozzle by removing residues, they do not necessarily perform a re-tinning of the solder nozzle which is critical to improving the flow characteristics of the molten solder.
An alternative method is to have the flux encased within a solder wire until the moment it is presented to the solder nozzle which is cleaner for the machine and provides a more precise placement which is critical when cleaning and re-tinning smaller diameter solder nozzles. To resolve the issue of ineffective nozzle cleaning and re-tinning, Nordson SELECT has developed an automatic solder nozzle tinning system that eliminates spraying altogether. This patent pending system uses a proprietary flux core solder wire to meticulously clean and re-tin the solder nozzle in a single integrated operation.
The advantage of the automatic solder nozzle tinning system is that it removes oxides and residues from the solder nozzle improving solder flow to ensure consistent soldering quality. Since the automatic solder nozzle tinning system does not produce overspray or contamination of the printed circuit board assembly or selective soldering machine, it is advantageous for clean production shop floor environments where caustic materials are not permitted.
About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra™ multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput. To find out more, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries. For more information, click here,
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.