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Eaton, SIAEC Announce Key Milestones for Joint Venture

09/25/2024 | BUSINESS WIRE
Intelligent power management company Eaton and SIA Engineering Company Limited (SIAEC) unveiled the logo for their joint venture, Eaton Aerospace Component Services Asia Sdn. Bhd. (EAS), at MRO Asia-Pacific.

Cybord Raises $8.7 Million Series A to Expand First-of-its-Kind Visual AI Electronic Component Quality and Traceability Solution

09/17/2024 | Cybord
Leveraging AI and big data, Cybord analyzes 100% of electronic components on the assembly line, verifying their reliability, authenticity, and traceability to support all industries utilizing electronic circuit boards, from automotive to data centers

Polymatech, ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France

09/12/2024 | PRNewswire
Polymatech, a multinational corporation (MNC), a leading player in semiconductor manufacturing with a strong presence in India and global business operations in USA, Singapore, Bahrain, UK and UAE announced the signing of a Memorandum of Understanding (MoU) with ECM Group, a globally recognised leader in advanced microelectronics and semiconductor technologies to establish a Joint Venture Company in Grenoble, France.

Lockheed Martin to Acquire Terran Orbital

08/16/2024 | Lockheed Martin
Lockheed Martin announced the signing of a definitive agreement to acquire Terran Orbital, a global leader of satellite-based solutions primarily supporting the aerospace and defense industries.

Thintronics Closes Its Series A Extension

08/15/2024 | BUSINESS WIRE
Thintronics Inc. closed its Series A Extension having added M Ventures, the CVC arm of Merck KGaA, TGVP, the US CVC arm of TOPPAN Holdings, and previous investor Tallwood Venture Capital to the Thintronics Series A syndicate.
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