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Advanced Electronics Packaging Digest

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Microelectronics Network Launches Semiconductor Workforce Advisory Committee

09/15/2026 | SEMI
The National Network for Microelectronics Education (NNME) announced the formation of its inaugural Industry Advisory Committee, bringing together senior leaders from the semiconductor industry, universities, and community colleges to help guide the network's national workforce strategy and strengthen the talent pipeline supporting America's growing microelectronics ecosystem.

SEMI Calls for Chips Act 2.0 to Boost Semiconductor Competitiveness

09/14/2026 | SEMI
SEMI renews its call on European policymakers to use the proposed Chips Act 2.0 to strengthen Europe’s semiconductor competitiveness, reinforce supply chain resilience, and create the conditions needed to attract and sustain investment across the entire semiconductor value chain.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

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Samsung Electronics, ASML Expand Semiconductor Collaboration

09/10/2026 | BUSINESS WIRE
Samsung Electronics and ASML announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

09/10/2026 | TPCA
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
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