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Advanced Packaging and Stackup Design: December 2024—Design007 Magazine

12/09/2024 | I-Connect007 Editorial Team
In this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.

Reports Indicate TSMC to Tighten Scrutiny on Chinese AI Chip Clients; Potential Revenue Impact Between 5% to 8%

11/11/2024 | TrendForce
Reports suggest that TSMC has notified its Chinese clients of a temporary suspension on shipments of advanced AI chips produced using 7nm and below process nodes.

Kimball Electronics Indianapolis Employees Volunteer for Million Meal Movement

10/28/2024 | Kimball Electronics
Employees from Kimball Electronics Indianapolis (KEIND) generously donated 61 hours of their time to support the Million Meal Movement, an initiative that addresses food insecurity while promoting the value of volunteerism.

IDC FutureScape: The AI Pivot Towards Becoming an AI-Fueled Business

10/21/2024 | IDC
According to a recent research from  International Data Corporation (IDC)  entitled The Global Impact of Arti f icial Intelligence on the Economy and Jobs, AI will have a cumulative global economic impact of $19.9 trillion through 2030 and will drive 3.5% global GDP in 2030.

Intel Celebrates AI Innovations by Students with Global Impact Festival

10/10/2024 | Intel
Intel announced the global prize winners at its fourth-annual AI Global Impact Festival. The festival celebrates student-led AI projects from 25 countries that address community issues and align with UN Sustainable Development Goals using Intel technologies.
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