Global Citizenship: Comparing and Contrasting the U.S. and China PCB Industries
Standard of Excellence: Finding and Hiring the Right Candidates for Engineering Positions
Global Sourcing Spotlight: 10 Rules of the Game
IPTE Launches Multi Magazine Loader/Unloader
September 12, 2018 | IPTEEstimated reading time: 2 minutes
IPTE introduces the new multi magazine loader/unloader—an innovative solution for the end of line automation.
The board handling components MLL 3P and MLU 3P are designed as multi magazine loader/unloader for loading or unloading production lines with processed or partially-processed PCBs. At the end or the start of the production line the PCBs are transferred from or into a rack. The central part of the loader/unloader is a servo driven conveyor shuttle that can pick up or store a PCB from any slot in one of the magazines. Therefor the cycle time and maintenance is dramatically improved by removing movement of the magazines.
The system can hold three regular magazines. It is efficient, fast, productive and it operates very silent. The infeed/outfeed position can be freely programmed in both Z and Y position making it a perfect fit for any SMT line. The components MLL 3P and MLU 3P offer a lean design with optimized footprint. The solid frame is made from welded steel. A light curtain is used for safety allowing the operator to remove or insert magazines without any hassle.
Loading and unloading sequence can be fully programmed, as well as pass/fail separation for the unloading. A color touch screen gives access to all parameters and settings. A diagnostic tool is integrated as well.
The standard MLL 3P or MLU 3P is designed for three magazines. Depending on the size it can be optionally equipped for up to ten magazines.
The multi magazine loader/unloader MLL 3P and MLU 3P are ready to be used with an automated guided vehicle (AGV ready). The necessary interface is optionally available. Another option is a machine with loading and unloading functionality in one system.
About IPTE
IPTE was founded 1992 in Belgium. IPTE is a worldwide supplier for individual, flexible and high-technology automated product equipment. The company designs standard machinery and turnkey-automation systems of all kinds for production, test and further processing of printed-circuit boards, as well as of board assemblies and final products. IPTE runs eleven sites in Europe, America and Asia with currently more than 800 employees. The IPTE Group's client list includes considerable manufacturers of the telecommunications industry, the consumer electronics branch, the industrial and motor vehicle electronics as well as producers from the assembly technology and the manufacturing sector. IPTE’s headquarters is located in Genk, Belgium. Other important sites are located in Germany and France.
Share on:
Suggested Items
DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development
10/30/2024 | DuPontDuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.
Wearable Technology Market worth $152.82 Billion by 2029
10/30/2024 | PRNewswireThe global wearable technology market is expected to be valued at USD 70.30 billion in 2024 and is projected to reach USD 152.82 billion by 2029; it is expected to grow at a CAGR of 16.8% from 2024 to 2029 according to a new report by MarketsandMarkets™.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
Keysight, ADI Partner to Develop GMSLTM Test Methodology
10/30/2024 | BUSINESS WIREKeysight Technologies, Inc. and Analog Devices, Inc. (ADI), a global semiconductor leader, have collaborated to create a comprehensive test solution for Gigabit Multimedia Serial Link (GMSL2TM) devices.
ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing
10/30/2024 | JCN NewswireULVAC, Inc., the world’s leading comprehensive vacuum manufacturer, has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.