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IPC and AATCC to Host Joint Session at AATCC Committee Meetings
October 5, 2018 | IPCEstimated reading time: 1 minute
IPC and the American Association of Textile Chemists and Colorists (AATCC) will host a joint session, Get Hands-On With E-Textiles Standards and Test Methods, on November 12, from 3:00-5:00 p.m. (ET), prior to the AATCC Fall Committee Meetings.
During this session, IPC and AATCC will provide an overview of the standards projects of the IPC D-70 E-Textile Committee and AATCC's various working groups. You will also learn how IPC and AATCC are working together and how to get involved with our activities.
The forum will include a standards and test methods brainstorming session for you to bring your organization's ideas, needs and issues that can be resolved through industry standards. Anything is up for debate! IPC and AATCC staff will present your ideas to committee leadership as potential new projects by IPC D-70, AATCC or a joint standard working group.
Unique to any other standards meeting you will attend, AATCC will also have e-textiles materials and testing equipment available for attendees to get a hands-on experience with standards and test methods.
AATCC also invites all IPC D-70 Committee members to attend the RA111, Electronically-Integrated Textiles meeting or any other committee meeting that interests you.
Register for the IPC/AATCC joint session and AATCC committee meetings, click here.
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09/04/2024 | Michelle Te, IPC CommunityIPC member DETEX Corporation of New Braunfels, Texas, like so many similar companies, strives to cultivate a highly skilled workforce to meet the growing demand for electronics assembly professionals. But also like many companies, DETEX, which engineers and manufactures security products, has struggled to hire qualified workers. Most employees are hired without certification or experience. Providing on-the-job training (OJT) without technical instruction has been met with limited success.
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Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.