Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Koh Young Technology to Highlight Next-Level Connectivity at IPC APEX EXPO 2019
January 22, 2019 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the industry’s leading smart factory solutions provider, will highlight latest process optimization solution with its KY8030-3 3D SPI for solder paste printing at IPC APEX EXPO 2019 show during 29-31 January 2019 at the San Diego convention center. The Koh Young Process Optimizer (KPO) solution is a comprehensive process optimization solution suite, which maximizes throughput and increases ROI by recommending optimal print parameters.
The Koh Young Process Optimizer (KPO), which recently accepted the award for Best Process Control Software at the Mexico EMS Technology Award ceremony, is Koh Young’s long-awaited realization of the desire to contribute to the evolution of industrial innovations. KPO, comprised of several interlinking software modules, automatically analyzes SPI data in real-time, recommends print parameters based on DOE results, and alerts operators to print process issues with real-time AI-based monitoring of SPI results. An intuitive, graphical user interface puts real-time data analytics at the forefront (Figure 1).
Figure 1: Example images of the KPO software User Interface
By incorporating Koh Young’s true 3D measurement data, KPO allows manufacturers to quantitatively manage printer settings and optimization time without highly experienced operators. Beyond its industry-leading accuracy, KPO verifies DOE-tested parameters with new DOE Reliability Report; which shows how reliable conducted DOE is before recommending the optimal parameters. The engine also allows the user to remove and rerun outliers to enhance the reliability and the fitness of DOE modelling. With KPO, SPI goes far beyond catching good board/bad board.
Moreover, Koh Young will also show the latest KSMART solution, which leverages true 3D measurement data to help manufacturers operate lines more efficiently. For instance, the LM@KSMART (Library Manager) module simultaneously deploys stored programs and inspection conditions across multiple lines, while RTM@KSMART (Real Time Monitoring) displays relevant process parameters to remote locations for immediate analysis. The latest KSMART solution performs with improved usability and versatility, where users can simply click through menus to drill down into details for the information needed.
As the absolute leader in the SPI and AOI market with over 13,000 machines delivered worldwide, Koh Young will showcase a broad set of its latest developments, including the new KY-P3 pin inspection solution and Meister D semiconductor solution. Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 1908.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.