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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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RTW IPC APEX EXPO 2019: Enabling Complete Automation for Customers
February 13, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Steve Williams and Saki CEO Norihiro Koike discuss Saki's AOI equipment and complete solution for electronic manufacturers, the industry-leading accuracy of their 3D equipment, and their recent Panasonic IoT certification to provide process data back to the pick-and-place equipment.
Koike also talks about how they enable complete automation for their customers.
To watch the interview, click here.
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Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year
09/05/2024 | SEMIGlobal semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same p
Delta Acquires Alps Alpine's Power Inductor Business Assets to Enhance Next-Gen Passive Components
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CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
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Target Condition: My Anti-venom to PCB Cost Adders
08/27/2024 | Kelly Dack -- Column: Target ConditionAs a kid, I remember long, hot, cross-country trips to the Midwest with my grandparents to visit relatives. Riding in the backseat of a 1970s station wagon without air conditioning, the only thing I had to look forward to was stopping at Stuckey’s in Oklahoma, which had a snake farm right next door. As luck would have it, after a hundred miles of passing signs advertising “Ramona’s Snake Farm,” Grandpa pulled in and made my trip come alive. I’d never seen a poisonous snake up close, and there were hundreds of them.