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Zuken Launches 3D Harness Design SolutionMarch 1, 2019 | Zuken
Estimated reading time: 2 minutes
Zuken introduces E3.WiringSystemLab, a new software solution that enables the optimization of complex wire harness designs based on inputs from heterogeneous sources. The product can import connectivity information from a broad range of sources and consolidates them with 3D topology data. The resulting 3D topology can be evaluated and optimized in a consistent 3D environment that has been designed to support the needs of casual users without requiring specialized training. Specialized functionality tailored specifically to topology exploration provides the ability to create and evaluate different architectural concepts.
Connectivity data can be imported from E3.cable, as well as via industry standard formats such as KBL, VEC, PLMXML, or even generic Excel® files. Topology information is imported in the form of geometrical bundles defined in the MCAD systems like CATIA, NX or Creo. Based on these inputs, E³.WiringSystemLab provides the ability to host the complete wire harness optimization process within in a consistent 3D environment. Comprehensive modifications can be applied to the imported harness, including changes of packaging, partitioning into sub-harnesses and insertion of new routing pathways.
“Optimizing wire harness designs to meet targeted weight and cost objectives is a complex and challenging task”, comments Reinhold Blank, Zuken Business Director for Automotive & Transportation. “In particular, the preparation of data that typically involves a laborious flattening to 2D has been a huge time sink for the industry. With E3.WiringSystemLab we are providing a solution that revolutionizes the import and consolidation of data sources from different origins and supports wiring system experts to optimize their complex designs in a modern 3D environment.“
With its generic cost and weight evaluation and exploration capabilities, Zuken’s E3.WiringSystemLab achieves a substantial reduction of ramp-up and optimization cycles for wiring harness engineers.
Zuken’s new harness topology optimization E3.WiringSystemLab will be presented at the following events:
USA: Zuken Innovation World Americas
Hilton Head, SC, April 15 – 17, 2019
Europe: Automotive Wire Harness Conference
Ludwigsburg, Germany, March 26–27
E3.WiringSystemLab provides optimization capabilities of imported wire harness designs: add/delete bundles and route pathways (1), change position of components, splices and ground bolts (2), modify partitioning of harnesses (3)
With easy-to-use cost and weight evaluation and modification capabilities, Zuken’s E3.WiringSystemLab enables a substantial reduction of ramp-up and optimization cycles for wiring harness engineers.
Zuken is a global provider of leading-edge software and consulting services for electrical and electronic design and manufacturing. Founded in 1976, Zuken has the longest track record of technological innovation and financial stability in the electronic design automation (EDA) software industry. The company’s extensive experience, technological expertise and agility, combine to create world-class software solutions. Zuken’s transparent working practices and integrity in all aspects of business produce long-lasting and successful customer partnerships that make Zuken a reliable long-term business partner. Zuken is focused on being a long-term innovation and growth partner. The security of choosing Zuken is further reinforced by the company’s people—the foundation of Zuken’s success. Coming from a wide range of industry sectors, specializing in many different disciplines and advanced technologies, Zuken’s people relate to and understand each company’s unique requirements.
Pacific Northwest National Laboratory is collaborating with leading technology companies Microsoft Corp. and Micron Technology to make computational chemistry—a challenging subject but one with far-reaching significance for our lives—broadly available to applied researchers and industrial users.
CACI Successfully Completes Optical Communications Terminal Interoperability Testing for Space Development Agency’s Transport Layer09/25/2023 | CACI International Inc.
CACI International Inc announced that it successfully completed Optical Communication Terminal (OCT) Interoperability Testing (OIT) of its CrossBeam® OCT for the Space Development Agency’s (SDA) Tranche 1 data relay and tracking network
Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, will discuss the increasingly significant role of data collection and analysis to enable Generative Artificial Intelligence (GenAI) functionality to improve productivity in our industry.
This week has been chock full of news about upcoming trade shows and conferences. Clearly, the season is upon us. This week, I-Connect007 reported on PCB West in Santa Clara (often referred to as the show which kicks off trade show season) and the topic of artificial intelligence was everywhere. By the looks of it, not just at the conference, either. For months now, the mainstream media has been gobbling up all sorts of news about generative AI engines, painting the picture that we’ll all lose our jobs to these tools, while also reporting on situations where the results from AI have gotten progressively worse over time.
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes09/21/2023 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum.