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RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530
March 13, 2019 | Real Time with...IPCEstimated reading time: Less than a minute

Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization.
Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.
To watch the interview, click here.
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U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown
09/17/2025 | I-Connect007 Editorial TeamManufacturers in the U.S. are cutting jobs even as President Donald Trump pushes policies he says will revitalize the industry. Employers shed 12,000 manufacturing jobs in August, while payrolls in the sector have fallen by 42,000 since April, according to a new analysis from the Center for American Progress (CAP) based on government labor data.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
09/17/2025 | GlobalFoundriesGlobalFoundries announced that the World Economic Forum (WEF) has designated its 300mm fab in Singapore as part of the Global Lighthouse Network (GLN) of advanced manufacturers.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.