Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Rogers Introduces New Waterproof Flexible Heater Substrate
March 21, 2019 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation is pleased to introduce ARLON® water-resistant substrate for flexible (“flex”) heater applications. Available for use in a vast range of industries, the new substrate is designed to improve performance and reliability of both etched-foil and wire-wound flex heaters, particularly those operating in high moisture or underwater environments.
Instead of the fiberglass fabric typically used in flex-heater substrates, Rogers’ new ARLON® 34C36 water-resistant substrate combines high performance silicone with layers of Rogers’ own DeWAL® Polytetrafluoroethylene (PTFE) film. As PTFE is hydrophobic and will not wick water, the new substrate remains robust and durable in wet environments. Fiberglass fabric, on the other hand, is hydrophilic and wicks water, allowing moisture to seep into the heater through exposed fibers. Flexible heaters made of the new ARLON substrate will function better in wet environments that could, otherwise, be at risk of inefficient heating or mechanical failure.
ARLON 34C36 waterproof flex-heater substrate combines the PTFE film with uncured silicone on one side, and cured silicone on the other. The substrate is available in both 20 mil (.508 mm) and 30 mil (.762 mm) thicknesses. As with all ARLON flex-heater substrates, the new substrate is Underwriters Laboratory (UL) recognized for relative thermal index (RTI) ratings up to 220ºC (428°F), flammability ratings for horizontal burn (UL94 HB), and the highest resistance to vertical burn (UL94 V-0) for electrical insulation of flexible heaters.
Rogers offers a full line of ARLON silicone rubber / fiberglass fabric flex-heater substrates. These composites operate reliably and offer long service life under most environmental conditions. ARLON offerings are also available with pre-bonded resistive foils, such as Alloy 600 and stainless steel, to eliminate the initial bonding step from the flexible heater manufacturers’ process. Utilizing pre-bonded resistive foils also enables the flexible heater manufacturer to process the material in continuous roll-to-roll rather than piece-by-piece to realize reduced costs.
“We’re proud to introduce a waterproof option to our portfolio of high-performance flex-heater substrates,” states Tim Wilson, Rogers’ Market Segment Manager for ARLON products. “By combining the hydrophobic properties of PTFE with the robust properties of ARLON® silicone rubber, the new substrates deliver a new standard in reliability and moisture resistance.”
Click here for more information on ARLON substrates. For more information on the Rogers family of elastomeric material solutions, rogerscorp.com/ems.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Real Time With... IPC APEX EXPO 2025: Best Student Technical Paper Winner—Attila Rektor
04/10/2025 | Marcy LaRont, I-Connect007Attila Rektor, a Ph.D student from Boise State, won the best technical paper award at IPC APEX EXPO 2025. His paper explores enhancing the conductivity of laser-induced graphene for flexible circuits. The research, funded by SAIC, involved modulating surface energy to enable effective copper plating. This breakthrough has potential applications in flexible printed circuit boards, sensing, and biomedical devices.
Real Time with... IPC APEX EXPO 2025: Advancements for Flexible Circuit Technologies
04/11/2025 | Real Time with...IPC APEX EXPOMark Finstad and Chris Clark from Flexible Circuit Technologies discuss their new marketing campaign for catheter circuits, featuring larger formats and advanced specifications. They explain the development of in-house materials for high-density circuits, enhancing cost competitiveness. They highlight the opening of a new facility in China for advanced assembly services, along with focused training sessions to fill industry education gaps and promote early customer engagement for better project outcomes.
CEE PCB Appoints Markus Voeltz to Business Development Director Europe
04/02/2025 | CEE PCBCEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and began providing local support in March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice.