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Aismalibar Underscores Commitment to Sustainability
July 16, 2019 | AismalibarEstimated reading time: 1 minute
Aismalibar has taken a step forward in terms of environmental sustainability by installing photovoltaic panels on the roof of its Barcelona plant.
Green energy is a priority for Aismalibar and this installation allows the company to generate sustainable power for self-consumption. To date, this generated force represents one third of the energy necessary for the operation of the factory.
According to the data of the Solar Energy Institute of the Polytechnic University of Madrid, at the end of 2017 in Spain, 4.5GW of photovoltaic were installed, placing the country in the 10th position worldwide. The same year, photovoltaic energy accounted for 3.1% of national electricity demand, so we are still talking about a residual presence of this type of energy in the Spanish scenario.
The investment in sustainable energy is in fact a commitment not to compromise the needs of future generations, but the global alarm in terms of environmental pollution, require a firm commitment to improve the production processes of industries.
The response to this situation is not limited to the Aismalibar plant, but the Benmayor Group has other companies linked to sectors such as health or the automotive industry and totals more than 1MW of photovoltaic installations. The data collected indicate that with self-generated green energy, the Benmayor Group covers more than 50% of the electricity consumption of its production plants.
About Aismalibar
Founded in 1934 and based in Barcelona, Spain, Aismalibar manufactures high end copper and metal clad laminates for the printed circuit board industry. Aismalibar’s expertise lies in offering the best solutions to reduce the operational temperature of the printed circuit boards. Aismalibar materials ensure quality and reliability of all the products that incorporate them. Aismalibar has implemented a 100% proof test with 1-3KV (high pot test) to every IMS laminate that is produced. These materials minimize the use of supplementary fans or heat sinks, thus reducing production costs. Aismalibar now operates globally through several subsidiaries. Our priorities are now, and have always been technological innovation and customer satisfaction.
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Simon Khesin - Schmoll MaschinenSuggested Items
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02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.