-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Innovators from NASA, Lockheed Martin Space, and Lenovo to Keynote SMTA International 2019
August 9, 2019 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International, September 22-26, 2019 in Rosemont, Illinois, USA.
Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence.
W. Michael Hawes, DSc, Lockheed Martin Space, will deliver his keynote address, “To the Moon and Back—Orion’s Next Jump into Deep Space,” on the morning of Wednesday, September 25. NASA’s Artemis program has a bold charter to land American astronauts, including the first woman and the next man, on the Moon by 2024. To achieve this feat, the Orion spacecraft has been designed, developed and tested by Lockheed Martin to gear up for the next giant leap into deep space. Dr. Mike Hawes will provide a behind-the-scenes look at Orion’s development and technology innovations that empower this next generation spacecraft to take astronauts to explore farther than humankind has ever ventured.
Tadashi Kosuga, distinguished engineer and director, commercial subsystem development, at Lenovo Corporation, will keynote the Low Temperature Solder Symposium on Monday afternoon. This co-located event provides a unique opportunity to engage with a wide array of industry members that are actively expanding their in-depth process knowledge and implementing tin-bismuth based low temperature solders.
Taking place September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois, the conference features 15 Professional Development Courses, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing and assembly industry.
The early registration discount deadline is August 30, 2019. For full details and to register for SMTA International, visit www.smta.org/smtai/.
About SMTA - A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
All Flex Solutions Invests in Assembly Inspection Automation
10/17/2024 | All Flex SolutionsAll Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
TopLine to Exhibit 'Drop-in Replacement' for BGA at Electronica
10/16/2024 | TopLineTopLine Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428.
Indium Experts to Present at International Electronics Manufacturing Technology Conference
10/15/2024 | Indium CorporationIndium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
The SD11 Inkjet Printer and Ventec Giga Solutions
10/10/2024 | Marcy LaRont, PCB007 MagazineVentec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.