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Innovators from NASA, Lockheed Martin Space, and Lenovo to Keynote SMTA International 2019August 9, 2019 | SMTA
Estimated reading time: 1 minute
The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International, September 22-26, 2019 in Rosemont, Illinois, USA.
Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence.
W. Michael Hawes, DSc, Lockheed Martin Space, will deliver his keynote address, “To the Moon and Back—Orion’s Next Jump into Deep Space,” on the morning of Wednesday, September 25. NASA’s Artemis program has a bold charter to land American astronauts, including the first woman and the next man, on the Moon by 2024. To achieve this feat, the Orion spacecraft has been designed, developed and tested by Lockheed Martin to gear up for the next giant leap into deep space. Dr. Mike Hawes will provide a behind-the-scenes look at Orion’s development and technology innovations that empower this next generation spacecraft to take astronauts to explore farther than humankind has ever ventured.
Tadashi Kosuga, distinguished engineer and director, commercial subsystem development, at Lenovo Corporation, will keynote the Low Temperature Solder Symposium on Monday afternoon. This co-located event provides a unique opportunity to engage with a wide array of industry members that are actively expanding their in-depth process knowledge and implementing tin-bismuth based low temperature solders.
Taking place September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois, the conference features 15 Professional Development Courses, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing and assembly industry.
The early registration discount deadline is August 30, 2019. For full details and to register for SMTA International, visit www.smta.org/smtai/.
About SMTA - A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Dynamic Grid has ordered a Hentec Industries/RPS Valence 3508 selective soldering system.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on March 7 at Sweeney Barn in Manassas, Virginia.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.