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Ups and Downs in the World Market

02/29/2024 | Pete Starkey, I-Connect007
The keynote session for the EIPC 2024 Winter Conference addressed several topics, ranging from applications for superconductivity to the fluctuating European financial market and the importance of IC substrates. The conference took place in late January at the IHK Academie in the city of Villingen-Schwenningen, on the eastern edge of the Black Forest in southwest Germany. 

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies

02/29/2024 | IPC
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

Sondrel Announces Two New Design Contract Wins

02/29/2024 | Sondrel
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.

Embedded Capacitors for PCBs, Chips, and Packages

02/26/2024 | Cody Stetzel, Cadence Design Systems
Package designers and chip designers assist the PCB layout engineer by including embedded capacitors on-chip and in-package to address the entire range of frequencies where decoupling is needed. As more electronics companies take a leading role in chip and package design, there is a need to determine the appropriate amount of capacitance needed to ensure low PDN impedance throughout broad frequency ranges. This article will look at the different types of capacitors that can be used as embedded components in PCBs and in chips/packages.

SIA Commends CHIPS Act Incentives for GlobalFoundries Projects

02/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
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