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iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/24/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.

ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

07/24/2024 | ASMPT
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

Ian Walsh Appointed as Sondrel’s Regional VP for America

07/23/2024 | Sondrell
Sondrel, a leading provider of ultra-complex, custom chips for leading global technology brands, has appointed Ian Walsh as its Regional VP for America, with the responsibility of growing Sondrel’s US semiconductor business from its new Silicon Valley offices in Santa Clara, CA.

Merck KGaA, Darmstadt, Germany, to Acquire Unity-SC

07/19/2024 | Merck KGaA
Merck KGaA, Darmstadt, Germany, a leading science and technology company, intends to acquire Unity-SC, a provider of metrology and inspection instrumentation for the semiconductor industry.

Banking Electronic Chips for the Next Boom (or Bust)

07/18/2024 | Power PR
Today, the parallels between the electronic chips that power just about every type of device today and the global oil market are undeniable, with many news outlets – including the Wall Street Journal, proclaiming in headlines that “Chips Are the New Oil.”
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