Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

GlobalFoundries, BAE Systems Collaborate on Semiconductors for Space

11/20/2025 | Globe Newswire
GlobalFoundries (GF) announced that BAE Systems will use GF’s advanced FinFET semiconductor technology in a new offering for space applications.

SEMI Europe Publishes 30 Recommendations for a Forward-Looking European Chips Act

11/19/2025 | SEMI
Following the official approval of the SEMI European Advisory Board, SEMI announced the publication of the SEMI Europe Chips Act Report a comprehensive assessment of the implementation of the European Chips Act and its impact on Europe’s semiconductor ecosystem.

VORAGO Launches Radiation-Tolerant Chips for Next-Gen Satellite Constellations

11/17/2025 | BUSINESS WIRE
The booming satellite industry just received a massive cost-saving injection paired with unprecedented ease of integration. VORAGO Technologies announced a world first: the launch of four radiation-tolerant microcontrollers purpose-built for low Earth orbit (LEO) markets at a fraction of the cost of traditional space-grade components, with first chips shipping in early Q1 2026.

Tesla Weighs Building ‘Gigantic’ Chip Fab to Meet AI Demand

11/17/2025 | I-Connect007 Editorial Team
Tesla CEO Elon Musk said the company will probably need to build a “gigantic” semiconductor fabrication plant to support its expanding artificial intelligence and robotics plans, CNBC reported.

SAICEC, Siemens to Accelerate Chip-to-Vehicle Validation Using Digital Twin Technology

11/17/2025 | Siemens
Siemens announced that SAICEC, a leading provider of chip and system design services for the automotive industry, has begun building complex digital twins of automotive architectures based on Siemens’ PAVE360™ software, facilitating comprehensive verification of automotive components from system-level to chip-level.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in