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Manufacturers Anticipate Completion of NVIDIA’s HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026

11/28/2023 | TrendForce
TrendForce’s latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung’s HBM3 (24GB) is anticipated to complete verification with NVIDIA by December this year.

Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors

11/27/2023 | IPC
IPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”

IPC Applauds New U.S. Government Strategy for Advanced Packaging

11/22/2023 | IPC
The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.

Avicena will Showcase the World’s Smallest 1Tbps Optical Transceiver at the SuperComputing Conference 2023 in Denver, CO

11/14/2023 | Avicena
Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the SuperComputing Conference (SC23) in Denver, CO.

Keysight Validates First Test Case for 3GPP Release 17 Non-Terrestrial Networks Standard

11/09/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. has validated the first protocol conformance test case for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks using narrowband internet of things (NB-IoT) technology.
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