Tunable Optical Chip Paves Way for New Quantum Devices
October 7, 2019 | OSAEstimated reading time: 5 minutes
Testing the integrated device
The researchers tested the performance of the fabricated integrated microring resonators and microheaters by applying different levels of electrical power and then measuring the optical transmission of the waveguide coupled to the microring resonator. Their results showed that it is possible to achieve high-quality resonators with low-power thermal tunability through a robust device that can be manufactured using existing semiconductor foundry processes.
“Combined with other unique features of our crystalline SiC-on-insulator platform, these high-quality devices have the basic requirements for enabling new chip-scale devices that operate in a wide range of wavelengths,” said Ali Adibi, the team leader. “This chip-scale tunability is essential for performing quantum operations necessary for quantum computing and communication. In addition, because of the biocompatibility of SiC, it could be very useful for in vivo biosensing.”
The researchers are now working to build elements with the crystalline SiC-on-insulator platform for quantum photonic integrated circuits, including on-chip pump lasers, single photon sources and single photon detectors that could be used with the tunable microring resonator to create a fully functional chip for advanced optical quantum computing.
This work is the result of three years of extensive research in forming a reliable hybrid platform with considerably improved SiC material properties and using it for forming innovative devices. Xi Wu, Tianren Fan, and Ali A. Eftekhar in Ali Adibi’s research group contributed immensely to this work. Hesam Moradinejad, a former member of Adibi’s researcher group, also contributed to the platform development (published earlier). This work was primarily funded by the Air Force Office of Scientific Research (AFOSR) under grant number FA9550-15-1-0342 (G. Pomrenke).
About Optics Letters
Optics Letters offers rapid dissemination of new results in all areas of optical science with short, original, peer-reviewed communications. Optics Letters accepts papers that are noteworthy to a substantial part of the optics community. Published by The Optical Society (OSA) and led by Editor-in-Chief Xi-Cheng Zhang, University of Rochester, USA, Optics Letters is available online at OSA Publishing.
About The Optical Society
Founded in 1916, The Optical Society (OSA) is the leading professional organization for scientists, engineers, students and business leaders who fuel discoveries, shape real-life applications and accelerate achievements in the science of light. Through world-renowned publications, meetings and membership initiatives, OSA provides quality research, inspired interactions and dedicated resources for its extensive global network of optics and photonics experts. For more information, visit osa.org.
Page 2 of 2Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
PsiQuantum Raises $1 Billion to Build Million-Qubit Scale, Fault-Tolerant Quantum Computers
09/10/2025 | BUSINESS WIREPsiQuantum announced it has raised $1 billion in funding for its Series E round to build the world’s first commercially useful, fault-tolerant quantum computers.
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.