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Conductor Analysis Technologies announces the shipment of two second generation OM Thermal Stress Systems. One system was shipped to Preferred Testing Laboratory, located in Moorpark, CA; the other to Summit Interconnect Inc, located in Anaheim, CA.
This system builds on the earlier version developed more than 8 years ago with updated technology which performs reflow simulation fully compliant with IPC TM-650 Method 2.6.27. Systems are available on a lease/cost-per-cycle basis to circuit board manufacturers and for sale to qualified OEMs.
According to Lance Auer, engineering fellow at CAT, the system at Summit is the first of the new generation to be located at a printed circuit board manufacturer. The systems are intended to be readily available to the printed circuit board industry to enable the proper testing of microvias.
