Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Indium Inks Partnership With Mycronic
November 12, 2019 | IndiumEstimated reading time: 2 minutes
Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications.
The partnership with Mycronic will expand Indium Corporation’s portfolio of proven products designed to address evolving industry challenges. The collaboration will also ensure that new products are fully vetted and tested before users begin evaluations, testing, and ultimately high-volume production.
“At Indium Corporation, we believe that materials science changes the world,” said Ross Berntson, Indium Corporation President and Chief Operating Officer. “Through this partnership and by collaborating with Mycronic’s engineers on our new PicoShot™ solder product offerings, we’re able to bring to market new and innovative solder paste solutions to fit our customers’ needs.”
Mycronic’s MY700 platform is a leading technology for jet printing in the electronics industry, providing solutions to most production- related difficulties of applying solder paste. The solder paste coming out of this partnership will also be compatible with the previous-generation jet printer, MY600, and support existing Mycronic customers.
“It is important for Mycronic to mutually develop solder paste solutions with key players like Indium Corporation,” said Clemens Jargon, Vice President Global SMT at Mycronic. “This partnership will enable us to reach out to a much broader customer base all around the globe and support them on enhanced jet printing applications.”
PicoShot, the first solder paste for jet printing developed under the new partnership, is expected to be released by Q1 2020. PicoShot NC-5M solder paste is compatible with the customer-proven Indium8.9HF halogen-free no-clean solder paste, enabling it to be used in standalone applications such as SiP, jetting into cavities, stencil-replacement, shield attach, and microBGA, as well as complementing the stencil printing of Indium8.9HF. Although designed as a no-clean solder paste, PicoSho NC-5M can be cleaned easily with industry standard cleaning solutions.
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture, and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm. The Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, the United Kingdom, and the United States.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.