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Miniaturization Continues: Day 3 productronica Coverage
November 15, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

The conversations on day 3 of productronica continued, including topics such as flexibility, 5G capabilities, and increased data and intelligence. The theme from test and inspection equipment providers included increased capabilities in sensing, material handling, and visual inspection technologies. And through it all, one common perspective emerged time and time again: PCB manufacturing is now approaching the levels of line, trace, and component density that were once limited to the surface of a silicon wafer.
What was once a level of precision relegated to the smooth, mirror-like surface of a wafer slice and then sealed in a package, now is expected upon the relatively rough, uneven, and flexible surface of today’s newest materials. Organizations—equipment manufacturers, university research consortia, industry standards organizations, and more—are all collaborating to bring these capabilities to PCB fabrication.
On Thursday, I-Connect007 caught up with the likes of Isola, Koh Young, CyberOptics, ESI, PVA, Mirtec, Hitachi High-Tech, Indubond, Vayo Technology, Meyer Burger, Agfa, Polar, Rogers, and Orbotech. We also report on the IPC Hand Soldering World Championships, which concluded—with much excitement—Thursday afternoon. We will have coverage of the event and the awards ceremony soon.
One more day of productronica coverage still to come.
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Creating Connections in Mexico
07/30/2025 | Michelle Te, Community MagazineA concerted effort by the Global Electronics Association—Mexico team over the past year has created inroads for the Global Electronics Association (formerly IPC) with leading electronics companies, government offices, and academic institutions in Mexico. “Our goal is to bring more awareness to what the Global Electronics Association is and what it offers,” says Lorena Villanueva, senior director. “We also aim to increase our membership. Of 3,200 members of the Global Electronics Association, only 180 are in Mexico.”
Powering Progress: Summer 2025 Community Magazine Now Available
07/22/2025 | Community MagazineIn the new Summer 2025 edition of Community Magazine, members of the Global Electronics Association demonstrate what progress really looks like—through innovation on the factory floor, influence on public policy, and investment in the next generation of engineers.
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
07/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsIf you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.
IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
07/15/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.