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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Chris Hrusovsky Joins IEC
November 18, 2019 | IECEstimated reading time: 1 minute
Chris Hrusovsky has recently joined IEC (International Electronic Components). Chris will be building IEC’s Central, Midwestern and Eastern region sales and service capabilities.
Joining IEC after 30+ years in the industry, Chris has held various field and management positions within MacDermid (formerly Electrochemicals/OMG), Insulectro, and most recently with MivaTek Global.
A graduate of Youngstown State University with a degree in Chemical Engineering, IEC is fortunate to have Chris join our team as we continue to build momentum with the Rogers high performance laminate products, bringing on RBP Chemicals as their exclusive North American partner, and continuing to establish the Eternal and Kodak Products as the highest technology offerings available.
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Sweeney Ng - CEE PCBSuggested Items
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
Rogers Announces Addition of Brett Cope and Eric Starkloff to Its Board of Directors
05/11/2026 | Rogers CorporationRogers Corporation announced that Brett Cope and Eric Starkloff were elected to the Company’s Board of Directors. Both Mr. Cope and Mr. Starkloff bring extensive executive leadership experience and deep expertise in highly relevant markets.
The Journey from Dilution to Zero Liquid Discharge
05/11/2026 | Richard Nichols, GreenSource EngineeringIf you’re familiar with the PCB industry, and a little long in the tooth like me, you may remember the cry, “The water board is here!” (or an equivalent authority). This was the signal for a frantic but regularly rehearsed exercise to turn on all the rinses. This anecdote demonstrates that in the early days of PCB production, prevailing practices revolved around a “dilution is the solution” mentality, in which manufacturers used copious amounts of water to dilute contaminants before discharging them into regulated municipal wastewater systems or natural water bodies.
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.
Nano Dimension Reports 106% YoY Revenue Growth in Q1 2026
05/08/2026 | Nano DimensionNano Dimension Ltd., a leader in digital manufacturing solutions, announced financial results for the first quarter ended March 31, 2026.