Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Firstronic Wins John G. Thodis Michigan Manufacturer of the Year Award
November 18, 2019 | FirstronicEstimated reading time: Less than a minute
Firstronic has been named winner of the John G. Thodis Michigan Manufacturer of the Year−Small Tier award by the Michigan Manufacturers Association (MMA). The announcement was made at the MFG Excellence Awards banquet held on Nov. 7 at the Kellogg Hotel and Conference Center in East Lansing, MI. This award program recognizes excellence in manufacturing by honoring those who make a positive impact in their community and in their industry. In addition to celebrating Michigan’s manufacturing community, the award ceremony featured an evening of best practice storytelling by the award winners.
“This award is further recognition of positive impact our Grand Rapids operation and team has on our community and state. It would be impossible to deliver a competitive “Made in USA” solution to our customers without the efforts of our exceptional team,” said John Sammut, Firstronic’s President and CEO.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Siemens, TRUMPF Partner to Accelerate Digital Manufacturing and AI Readiness
09/16/2025 | SiemensTechnology company Siemens and leading machine tools and laser manufacturer TRUMPF announced a partnership that promises to elevate industrial production by harnessing advanced digital manufacturing solutions.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.