Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
MacDermid Alpha Electronics Solutions Announces the Acquisition of Kester
December 3, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, a world leader in the production of innovative materials used in semiconductor, circuitry, and electronics assembly announced today that it has acquired Kester from Illinois Tool Works Inc.
Kester is a global supplier of assembly materials used in electronics assembly and semiconductor applications. The business has manufacturing facilities in the U.S. and Germany and its products serve customers globally across a diverse set of end-markets including consumer electronics, telecommunications, medical, automotive and military and aerospace.
“We are very excited to announce the acquisition of Kester. Kester has a long history of providing innovative and high-quality materials used in the assembly of semiconductor and electronics packages,” said Rick Ertmann, Senior Vice President of the Assembly Solutions division of MacDermid Alpha Electronics Solutions.
Mr. Ertmann continued his comments, “We believe that Kester’s product lines, customer relationships, and resources will augment our position in delivering solutions with the lowest total cost of ownership to our customers. With this acquisition, MacDermid Alpha will continue to be well-situated to capitalize on the many emerging trends in the electronics industry. As the lines between the assembly technologies that are employed in all facets of electronics continue to merge, we view this acquisition as one of many steps that we are taking to position the business for continued growth as we work with customers to solve their assembly packaging challenges.”
This acquisition is aligned with MacDermid Alpha Electronics Solutions’ strategic goals and priorities, namely to drive growth through the delivery of innovative, value added solutions and services into the global electronics assembly industry. Kester’s leading products and development initiatives will amplify the already strong programs in the MacDermid Alpha pipeline and will enable continued focus on high growth segments, such as automotive, PV, consumer, and communication.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
About Kester
Kester is a global supplier of assembly materials for the electronics assembly and semiconductor packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. www.kester.com
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.