One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
The Knowledge Base: Challenges and Considerations of Harsh Environments
MacDermid Alpha to Present Original Research at IPC APEX Conference and Expo 2020
December 20, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature three original research presentations during this year’s IPC APEX Conference and Expo, February 1-6, in San Diego, California.
MacDermid Alpha will present three papers during the technical conference. On Tuesday, February 4, Dr. Karen Tellefsen, Senior Scientist, will present "Advanced SIR Testing for Trapped Solder Paste Flux Residue." This paper will cover the importance of developing an SIR/ECM test methodology to support the development and implementation of new solder pastes being developed to provide better electrochemical reliability to meet the challenges of expanding BTC use in electronics assembly.
On Wednesday, February 5, Dr. Saminda Dharmarathna, Senior Research Scientist, will present "Acid Copper Electroplating Processes With Excellent V-Pit Resistance for Flash Etching." Sam will discuss a one-step DC copper plating process allowing excellent via fill and through hole capabilities in a single plating bath for core layers of HDI and IC substrates.
Lenora Clark, Director of Autonomous Driving and Safety Technology for MacDermid Alpha Automotive Solutions, will present on Thursday, February 6, on "Material Considerations for Automotive RADAR Designs." Clark’s paper will cover the importance of chemical process changes and material considerations to meet the reliability requirements of RADAR module builds. “The systems respond to navigation challenges which often remove the driver from the decision-making process.” said Clark. “Due to this, the reliability of advanced safety systems is critical.”
The use of low temperature solders will be the focus of the poster presentation, "Using Low Temperature Solder to Attach Brass Parts to a Copper Pad," by Dr. Traian Cucu, G.A.T.E Leader at MacDermid Alpha Electronics Solutions. This poster will explore the advantages and challenges of joint formation using low temperature solders as pertains to attachment of brass components to a pad.
To learn more about MacDermid Alpha’s materials solutions for optimizing electronics reliability and assembly, visit our IPC APEX Booth #1824 or our website: www.macdermidalpha.com.
Share on:
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.