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CyberOptics to Demo SQ3000 Multi-Function System with Advanced Software at IPC APEX
January 7, 2020 | CyberOptics CorporationEstimated reading time: 1 minute
 
                                                                    CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will showcase its SQ3000™ Multi-Function for AOI, SPI and CMM in Booth #3113 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Additionally, CyberOptics will demonstrate the latest 3D AOI software with ultra-fast programming capabilities, auto tuning and enhancements that significantly speed setup, simplify the process, reduce training efforts and minimize operator interaction.
The 3D SQ3000 all-in-one system can identify critical defects and measure critical parameters, providing a superior process control solution for effective yield management.
In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The world’s first in-line CMM includes an extensive software suite for metrology grade measurements on all critical points.
Powered by proprietary Multi-Reflection Suppression (MRS) sensor technology, the 3D SQ3000 all-in-one system offers an unmatched combination of speed, resolution and accuracy. The MRS sensor meticulously identifies and rejects reflections caused by shiny components making it an ideal technology solution for a wide range of applications with stringent requirements. The Ultra-High Resolution MRS sensor option delivers superior performance ideally suited for socket metrology, microelectronics and other applications where an even greater degree of accuracy and inspection reliability is critical.
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Julia McCaffrey - NCAB GroupSuggested Items
LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group
10/29/2025 | LPKFLPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.
American Standard Circuits Launches 50th 77-Second Webinar
10/27/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone Circuits is pleased to announce that they have recently unveiled their 50th 77-second webinar.
KYZEN Brings Reliability to Life at productronica 2025 with ANALYST² Process Control Demos
10/22/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at productronica 2025, November 18–21 in Munich, Germany, where the company will put a spotlight on its award-winning KYZEN ANALYST² process control system in Hall A4, Stand 450.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    