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CES 2020 Automotive: The Future Looks Like a Box
January 9, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
CES week has been true to the themes set forth by Steve Koenig on Sunday, and having spent most of Wednesday in the North Hall of the Las Vegas Convention Center—the automotive pavilion—I can say that Koenig was right: the electric vehicle has reached an inflection point. And along with electric propulsion came autonomous operation.
Electric vehicles were everywhere in the North Hall, taking the place of prominence with many for the major players in the automotive space. But what stood out to me was the two schools of design with respect to emerging autonomous electric vehicles. They were either shoeboxes on wheels or sleek, ultra-stylish, and super-hip vehicles.
Utility vehicles were everywhere on the show floor, ranging from high-capacity people-mover styles to the example application on display at the OSRAM booth: an autonomous vehicle that serves as a mobile parcel locker for packages delivered by shipping companies (e.g., UPS, or DHL, or Amazon).
There were a multitude of takes on the rolling shoe box throughout the show.
Even the Toyota Woven City project depends on such autonomous vehicles for slow-moving, utilitarian, local transport within the city plan. Other companies showing these rolling boxes included Cerence and Fiat Chrysler, among others. But then, things changed.Page 1 of 2
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New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.