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I-007e Micro Webinars Releases Part 2 in ‘Coatings Uncoated!’ Series
January 22, 2020 | The I-Connect007 TeamEstimated reading time: 1 minute
The second part of the popular webinar series, Coatings Uncoated, is now available to view. Author of The Printed Circuit Assembler’s Guide to... Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Got five minutes? Visit iconnect007.com/webinar/cu and watch the latest segment, Never Underestimate the Importance of the Application Process, which examines the pivotal role that application plays in the overall success of coating, and presents a great opportunity to grasp the importance of the process.
I-007eBooks and I-007e Micro Webinars: Your premier educational resource for circuit board design, manufacture and assembly.
I-Connect007 takes the on-demand webinar to a new level. A perfect companion to our I-007eBook series, these bite-sized webinars are released weekly, exclusively at I-Connect007, and also available all at once for those who can’t wait for the next installment
Electrolube’s Phil Kinner has been providing I-Connect007 readers with information, guidance and practical tips on the uses and applications of conformal coatings through Team Electrolube’s “Sensible Design” columns published over the last four years. Now, in his engaging, new, 12-part webinar series, Phil will delve even deeper into the subject, examining conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Each of the 12 segments can be viewed in about five minutes.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
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03/10/2026 | I-Connect007I-Connect007 announces the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics. In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
STMicroelectronics Completes Acquisition of NXP’s MEMS Business
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MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics
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Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
Real Time with... productronica 2025: Enhancing Manufacturing With Conformal Coatings From MacDermid Alpha
12/04/2025 | Real Time with...productronicaSaskia Hogan, global product manager for conformal coatings at MacDermid Alpha Electronics Solutions, discusses the role of coatings in improving manufacturing efficiency and sustainability. She addresses challenges faced by customers, such as harsher environments and cost pressures, while emphasizing the need for high reliability in critical applications.