The Knowledge Base: My 2025 Industry Wish List
Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
Nolan’s Notes: Emerging Trends in 2025
High Speed Via Reliability Testing Using Updated HATS² Technology
January 28, 2020 | Microtek Laboratories ChinaEstimated reading time: 1 minute
Highly Accelerated Thermal Shock (HATS™) High Speed Via Reliability test systems have now been updated with HATS²™ Technology. These updates provide HATS™ test systems with a wider temperature range (-55°C to 265°C), an improved measurement subsystem capable of high-current, micro-ohm precision, 4-wire resistance measurements and the ability to perform Multiple Cycle Convection Oven Reflow Simulation with in-situ resistance measurements in accordance with IPC-TM-650 Method 2.6.27B. This update also allows HATS™ test systems to test up to 72 IPC-2221B Type "D" coupons and 36 Traditional HATS™ or new HATS²™ Single Via coupons for both Multiple Cycle Convection Oven Reflow Simulation and Thermal Shock/Cycling.
The patented HATS²™ Single Via Test Coupon contains 7 Single Via Nets. Each of these Single Via Nets can be replaced by a daisy-chain net. This allows an updated HATS™ unit to collect electrical resistance data from both Single Via and Daisy-chain test nets for the via structures on the coupons.
According to Bob Neves, Microtek Laboratories China CTO/chairman, “Designers can include 1 or 2 daisy-chain nets along with 5-6 single via nets on the same HATS²™ Single Via Test Coupon. This should provide a bridge between traditional daisy-chain and single via net test results.”
For more information about HATS² Technology or the patented* HATS²™ Single Via Test Coupon, please visit HATS-Tester.com.
Share on:
Suggested Items
Hot Off the Press: Explore the New Issue of IPC Community
01/14/2025 | IPC Community Editorial TeamThe latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members. Find stories on IPC student leadership, successful women in business, the trouble with tariffs, the inside workings on an IPC mentorship duo, standards updates, and so much more.
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.
TRI Launches 3D AXI Platform with Clearer Imaging
01/10/2025 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600FB SII system, designed to deliver clearer imaging.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
Marcy LaRont Named I-Connect007 Executive Director
01/08/2025 | IPCMarcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.