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ASC International Showcases 3D AOI/SPI Innovations at IPC APEX EXPO 2020
January 31, 2020 | ASC InternationalEstimated reading time: 1 minute
ASC International, a leading global manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit at the IPC APEX EXPO, Booth 1537, on February 4-6, 2020 at the San Diego Convention Center, San Diego, CA.
ASC International will provide live demonstrations of their industry leading SPI and AOI solutions. Product innovations will be highlighted by the LineMaster Fusion 3D offering the industry’s most cost effective inline 3D SPI solution. LineMaster DM is ASC’s top seller providing offline 3D SPI and AOI as a combination package - all wrapped up into a price point similar to single technology platforms. VisionPro AV862 provides a value packed AOI solution with all of the features needed for accurate and reliable defect detection. VisionPro M500 offering the industry’s standard for comprehensive true 3D bench top SPI.
“After 20 year of participation in the IPC APEX Expo shows, we are very proud and excited to kick off our new product release for 2020 in San Diego” stated Steve Arneson, National Business Manager. “ASC continues to advance our mainline products and the recent release of our LineMaster Fusion 3D is just another important addition to our product offering showing our commitment to our customer’s requests for accurate, reliable and affordable inspection solutions.”
The VisionPro and LineMaster series of inspection systems incorporate the most advanced, rapid 3D/2D sensor technologies coupled with a feature-rich, intuitive graphical user interface all packaged in a rugged, bench-top or stand-alone platform.
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Julia McCaffrey - NCAB GroupSuggested Items
Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour
11/06/2025 | EssemtecEssemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology, now achieving 1.1 million dots per hour.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.