-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation, Finetech Partner for MIT Integrated Photonics Bootcamp
February 11, 2020 | Indium CorporationEstimated reading time: 1 minute
In January, Indium Corporation partnered with Finetech for MIT’s Integrated Photonics Bootcamp, a week-long, hands-on learning experience held at the MIT.nano facility in Cambridge, Mass., USA.
The training ran from Jan. 13-17 and allowed participants to explore and learn to solve problems using lab equipment, preparing them for the challenges to be faced in the workforce. Indium Corporation’s Andy Mackie, Senior Product Manager, and Meagan Sloan, Technical Support Engineer, met with students to talk about the chemistries and physical properties of bonding materials, and stressed the importance of using that information to select the right materials for their application.
“We were pleased to have the opportunity to partner with Finetech and MIT for this event,” said Mackie. “It provided us with the opportunity to educate students and industry participants, and to learn more about Finetech equipment capabilities and the specific materials needs of the photonics industry.”
Indium Corporation and Finetech’s session covered precision bonding fundamentals and featured optics, die and substrate temperature, alignment tolerances, thermal mismatch, inert atmosphere, and force. A review of bonding technologies included thermo-compression and thermo-sonic bonding, and UV adhesive cure.
Finetech provided a demonstration of flip-chip bonding using the FINEPLACER® lambda bonder. Participants learned about one of the most critical bonds in a complex surface mount photonic device—the assembly of QFN low-profile quad transceiver modules using thermo-compression bonding of a VCSEL onto a sapphire substrate. Each student had an opportunity to “drive” the equipment to get a feel for the sub-micron placement accuracy of the system.
Participants were fascinated to see and align such small features. Most couldn’t wait to get their hands on the machine and try the alignment process.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Suggested Items
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators
10/24/2024 | Jerome Larez -- Column: Global PCB ConnectionsIn my first column, I want to discuss the critical importance of communications between the PCB design and the PCB fabrication engineer. I’ll explore why clear communication is so important, highlight the differences between standard and CTQ items, and outline the key issues that must be agreed upon to achieve success in PCB manufacturing.
Untapped Potential: Automating Warehouse Management Into the Present
10/15/2024 | Josh Casper, Horizon SalesThe push toward automation in electronics manufacturing has led to significant improvements in SMT and through-hole technology (THT) production. Today’s manufacturers are outfitted with precision pick-and-place machines, sophisticated inspection systems, and advanced solder deposition solutions. These investments reflect a broader industry trend toward automating high-value production tasks to boost efficiency, improve quality, and reduce headcount in a shrinking labor market. While the spotlight has rightly focused on automating SMT production, one crucial area remains woefully under-invested: materials storage and handling.
Ventec Promotes Bill Wang to Group Technical Vice President
10/14/2024 | VentecVentec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.