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Ventec’s Materials are Enablers for 5G, Industry 4.0
February 26, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
During IPC APEX EXPO in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview from the show, Technical Editor Pete Starkey and Ventec COO for Europe and the Americas Mark Goodwin discuss Ventec’s latest high-speed, low-loss, high-frequency materials as enablers for 5G and Industry 4.0. They also take a look at a set of new materials for automotive applications, and the stability of Ventec's inventory and supply chain.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26-28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
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