-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
NPL to Host Electronics Reliability Webinars
February 27, 2020 | NPLEstimated reading time: 2 minutes
NPL is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. These FREE online webinars provide the opportunity to draw on years of practical experience without leaving your desk. To participate, you need a phone line and Internet access. Please note that registration is essential.
The majority of webinars run for 60 minutes and each one is limited to 100 delegate/company registrations. A copy of each of the slides presented and links to NPL reports will be provided after the webinar. In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines.
A New Draft Standard for Condensation Testing Martin Wickham/Ling Zou
17th March 2020
2:30 PM - 4:00 PM GMT
Achieving high reliability in service is the key issue in today’s high-density electronics assemblies. Electrochemical reliability becomes more critical, as electronic circuits move to increased packaging densities, and are operated in harsher environments (hotter/damper/condensing). Contaminants and bias with moisture facilitate electrochemical corrosion processes that result in a loss of continuity or short circuit (failures) on electronic assemblies. Moisture plays an important role for circuit failure, and condensation will accelerate the failures.
The electronics industry uses a number of condensation tests developed by large OEMs. They all differ and it is challenging and costly for materials suppliers to test multiple materials across all condensation tests. Additionally, most of these standards are based on changing the environment around the test vehicle to create condensation and are therefore highly dependent on the thermal mass of the test vehicle and capability of the chamber being utilised.
NPL has been working with industrial partners on a collaborative project to develop a new approach to create controllable condensation on test vehicles. The temperature of the test vehicles can be directly depressed to any required level without disturbing the stable environmental condition. Different levels of condensation can be cycled to simulate condensation real world scenarios. Results will be presented based on a test assembly with a range of fine pitch components including QFNs, QFPs and chip capacitors. In a 48 hour SIR test, coated assemblies with different coating variables, were subjected to eight increasing levels of condensation from low to high. The condensation level where SIR values dropped below 100 M? can be used to score the protection performance of different combinations of coatings, application processes and components. A draft standard is now in preparation and an outline of the new standard will be given for industry comment.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.
More Than Electrical Test: TTCI to Spotlight X-ray and CT Capabilities at SMTA Capital Expo
05/07/2026 | TTCIThe Training Connection LLC (TTC-LLC) will exhibit at the SMTA Capital Expo on Thursday, May 14 at the DoubleTree by Hilton Baltimore - BWI Airport.
The Test Connection, Inc. Adds Experienced Test Engineer to Expand Flying Probe and ICT Capabilities
05/06/2026 | The Training Connection LLCThe Training Connection LLC (TTC-LLC) has hired Hermes Gonzalez as a Test Development Engineer, adding deep experience in flying probe and in-circuit test (ICT) to its engineering team.
Nordson Test & Inspection Partners with Quiptech Mexico to Expand Market Presence
05/05/2026 | Nordson Test & InspectionNordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, announced a strategic partnership with Quiptech Mexico (a trading name of QTEK Mexico).