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Meet with KIC at the SMTA Dallas Expo and Tech Forum
March 2, 2020 | KIC ThermalEstimated reading time: Less than a minute
KIC announced that it will exhibit at the SMTA Dallas Expo and Tech Forum. The Dallas Expo is scheduled to take place Tuesday, March 24, 2020 at the Plano Event Center in Plano, TX. MB Allen, Manager for KIC’s Applications & Sales, will discuss the KIC ecosystem that includes automatic profiling, profilers, fixtures and software solutions for reflow, wave and curing.
KIC’s Smart Factory solutions provide automation, traceability, process control via continuous Cpk and live data collection and analytics with integration to MES, CFX and more.
Move toward the future of line connectivity, flexible production, machine learning and real-time insight.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Taking Control of PCB Verification One Step at a Time
10/09/2025 | Kirk Fabbri, Siemens EDAToday’s designs are as complex as ever, and engineers face tough decisions every day. Simulation and verification teams are confronted with a three-fold challenge: understanding the underlying theory, mastering the tools, and applying best practices.Engineers need to navigate a vast and ever-changing cast of design and simulation tools, often with overlapping functionality.
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
10/06/2025 | Happy Holden -- Column: Happy’s Tech TalkIn over 50 years as a PCB process engineer, the one skill I acquired in college that has been most beneficial is engineering statistics. Basic statistics was part of my engineering fundamentals classes, but I petitioned the dean to let me take the engineering statistics graduate course because I was creating a senior thesis for my honors focus and needed more training on Design of Experiments (DOE).
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.