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Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra 200V Series Processors

10/24/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel® Core™ Ultra 200V series.

Highlights of the ICT 50th Anniversary Symposium

10/24/2024 | Pete Starkey, I-Connect007
Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.

Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024

10/22/2024 | StratEdge
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).

Würth Elektronik Expands Ferrite Range for Electromobility Applications

10/22/2024 | Wurth Elektronik
With the WE-OEFA-LFS ferrite, Würth Elektronik is releasing an oval-shaped ferrite ring for interference suppression at low frequencies.

The Cost-Benefit Analysis of Direct Metallization

10/21/2024 | Carmichael Gugliotti, MacDermid Alpha
Carmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
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