-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ACDi’s North Carolina Manufacturing Plant Installs New Koh Young 3D SPI and AOI Equipment
March 9, 2020 | ACDiEstimated reading time: 1 minute

ACDi, a leading electronics manufacturing services provider, announces the most recent capital investment in printed circuit board inspection technology and equipment at their Nashville, North Carolina factory. Final equipment installation and training was recently completed incorporating 3D imaging technology at its Nashville facility with the addition of Koh Young KY8030-3 3D Solder Paste Inspection and Koh Young Zenith Alpha HS 3D Automated Optical Inspection Systems.
Electronics manufacturing industry standards estimate approximately 70% of surface mount technology (SMT) process-related defects originate from the solder paste printing process. Though most all SMT screen printing systems at a minimum incorporate 2D AQL selective inspection capability, having newly installed 3D solder paste inspection (SPI) verifies not only area (L/W) coverage of paste, but also analyzes third dimension volumetric deposition of solder paste. Adding this capability as an inline standalone machine directly behind the printer reduces the screen printer cycle time while also enabling 100% 3D real time total board paste inspection, stopping the process and prompting immediate operator process engagement and equipment adjustment as necessary. Additionally, the KY 8030 SPI system is Industry 4.0 capable for direct machine-to-machine interface with the factory’s Juki G-Titan automated printing system.
Additionally, once 3D SPI process verification has been assured, populated circuit board post reflow 3D Automated Optical Inspection (AOI) capability now validates not only 2D component placement accuracy related to presence, X/Y alignment, orientation and character recognition, but also enables third dimension imaging to verify Z-height factors including coplanarity, lifted leads, discrete SMD head-in-pillow (HiP), bridging, and overall solder joint integrity (insufficient or excess).
ACDi selected Koh Young, not just because they are the leader in number of 3D SPI and AOI systems installed, but to also offer commonality of equipment manufacturers at both our Frederick MD Corporate and Nashville NC production facilities. Standardizing on equipment supports business continuity factors where transition between locations adds value, and also facilitates collaboration among production and engineering staff at both sites further encouraging achievement of one of ACDi’s Fundamental Pillars of Success, a Team Oriented Workforce!
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.