Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
WAGO Products Join Amazon Web Services Partner Device Catalog and IoT Greengrass
March 20, 2020 | WAGOEstimated reading time: 1 minute
WAGO is pleased to announce that their Touch Panel 600 and Generation 2 PFC200 have been listed as part of Amazon Web Services (AWS) Partner Device Catalog for AWS IoT Greengrass 1.10.0.
The Touch Panel 600 line of Operator Interface devices brings high-tech screens and high quality visualizations to accompany machines. You have the ability to operate, observe, visualize and diagnose in factory, process and marine applications all within one operator interface.
The Gen 2 PFC200 controllers have increased processor speed and more onboard memory, and offer gateways between multiple industrial fieldbuses. They also enable data transfer with Cloud Services and SCADA via the MQTT protocol. An onboard web server enables dynamic HTML5 visualizations that can be used by operators and maintenance personnel for system operation. In addition, a built-in Firewall and VPN helps you deploy Defense-in-Depth strategies without the need for additional components.
Both products are Linux based and now have the ability to run AWS’s Greengrass Core service, enabling deployment of custom Lambda functions to the Edge device for scaleable IIoT applications.
AWS is a subsidiary of Amazon that provides on-demand cloud computing platforms and application program interfaces to individuals, companies, and governments on a pay-as-you-go basis. AWS Greengrass is a service that extends AWS functionality to Internet of Things (IoT) devices, allowing data collection and analysis closer to its origin. It also provides cloud-based management of application logic that runs on devices.
Share on:
Suggested Items
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Elektrobit, Metoak Forge Strategic Partnership to Establish New Benchmark for Intelligent Driving Safety Ecosystem
04/29/2025 | ElektrobitElektrobit announced a comprehensive strategic partnership with Metoak, a leading Chinese provider of intelligent driving solutions.
Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025
04/29/2025 | congateccongatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.