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Beat the Heat With New Book on Thermal Management Design Processes
September 15, 2020 | I-Connect007Estimated reading time: 1 minute
Learn how to beat the heat in your designs with The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective—the latest title in our educational library. The Printed Circuit Designer’s Guide to… series is specifically dedicated to educating PCB designers and serves as a valuable resource for people seeking the most relevant design information available.
Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.
Written by Anaya Vardya, president and CEO of American Standard Circuits, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.
Denis Boulanger, principal manufacturing engineer at Raytheon Technologies, says, "This book provides a comprehensive look at thermal management and PCB design issues from the fabricator’s perspective. I am glad that it exists now that I have 'gone over to the dark side,' where I am a consumer rather than a fabricator and/or material supplier."
PCB designers and design engineers, both new and veteran, will gain a thorough understanding of thermal management design processes.
Download your free copy today! You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.
We hope you enjoy The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective.
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Brent Fischthal - Koh YoungSuggested Items
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
02/16/2026 | Anaya Vardya, American Standard CircuitsThe electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes
NCAB Group Reports Strong Q4 and Year-End 2025 Results with Robust Sales and Order Growth
02/13/2026 | NCABNCAB Group released its Q4 and full-year 2025 results, reporting strong year-end momentum with double-digit growth in net sales and order intake, and a solid book-to-bill ratio of 1.21.
ICAPE: Consolidated Annual Revenue 2025
02/13/2026 | BUSINESS WIREAnnual revenue growth of +11.5% for ICAPE in 2025 to €202.7 million and organic growth excluding currency effects of +5.1%
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
High-Tech Hill in Lithuania: Europe’s PCB Comeback
02/12/2026 | Marcy LaRont, I-Connect007 MagazineTLT Manufacturing, part of the Teltonika group, is assembling something Europe hasn’t seen in decades: a fully integrated electronics manufacturing hub in Vilnius, Lithuania. Last September, TLT officially opened High-Tech Hill, its new technology campus, simultaneously launching four facilities: two EMS plants, a large greenfield PCB fabrication plant, and a plastic injection molding operation. This move brings design, tooling, production, and full manufacturing services under one roof.