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Isola Exhibits High-Reliability Copper-Clad Laminates at Virtual PCB West
September 8, 2020 | Isola GroupEstimated reading time: Less than a minute
Isola Group, the leading global and local manufacturer of copper-clad laminates and dielectric prepregs for use in the PCB boards announces it will participate in the virtual PCB West conference on September 9 and 10, 2020. The successful, long-running tradeshow was forced to go virtual this year due to COVID-19 pandemic and mandated social distancing
“In spite of the challenges of going virtual instead of face to face, Isola is presenting a broad array of products that are truly exciting for our customers,” commented Sean Mirshafiei, Isola Chief Sales & Marketing Officer. “We are exhibiting high speed digital products, like Tachyon® 100G, I-Tera® MT40, and I-Speed® that facilitate next generation designs. We will also be talking about our latest product development - our extremely low loss, halogen free laminate - TerraGreen® 400G. As circuit boards continue to become thinner, smaller, and faster, OEM designers are demanding a new breed of materials with lower loss and lower Dk to design and build boards that were never before possible.”
In addition to the HSD dielectric materials for advanced designs, Isola will also present other Halogen-free, high-reliable FR-4, and RF/Microwave laminates.
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Julia McCaffrey - NCAB GroupSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.