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Ucamco Releases Integr8tor v2020.08, Introduces UcamX Workflow Edition
September 14, 2020 | UcamcoEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/7816/3132/9804/new-icon.jpg)
Ucamco is happy and proud to present Integr8tor v2020.08. The newest release comes with a series of significant improvements, including the brand new UcamX Workflow Edition (WE) Graphics Editor.
With this new product, you can:
- Eliminate duplicate layers from the job stackup
- Add gold mask or peel-off layers to the job that are not available in the customer archive
- Merge split layers together (e.g. 1 layer with pads – 1 layer with traces to make for 1 physical copper layer)
- Read in the odd legacyGerber data set that still comes with old-school aperture lists
- Examine netcompare errors reported by the AutoReference option
- Simplify user experience by bringing a series of repetitive edits together in a small script under singleclick button on the customizable toolbar
Integr8tor v2020.08 is now available for download. We recommend that you upgrade to this new version at your earliest possible convenience. More information is available at Ucamco.com.
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Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.
Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.