Elementary, Mr. Watson: The Four Horsemen of Copper Confusion
The Shaughnessy Report: Zee Plane! Zee Plane!
Target Condition: Distribution of Power—Denounce the Ounce
Real Time with… AltiumLive 2020: A Novel Idea—Design With Manufacturing
October 7, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Andy Shaughnessy speaks with Jeremie Waller, senior electrical engineer at Quantel USA, about the panel he’ll be participating in during AltiumLive 2020 on design with manufacturing. He and panelists Gerry Partida of Summit Interconnect and Greg Zhiraldo of Advanced Assembly will discuss why designers need to see their fabrication and assembly providers as true partners, not just customers, and why communication is such a vital part of the design process.
Visit Real Time with… AltiumLive 2020 to catch the latest video interviews and event-related content.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Zuken Opens Call for Papers for ZIW Americas 2026
11/13/2025 | ZukenZuken USA, Inc. opens the Zuken Innovation World (ZIW) Americas 2026 Call for Papers to help engineers, managers, and leaders showcase proven results and advance industry best practices. ZIW is Zuken USA’s semi-annual Digital Engineering conference on electrical and electronic design for engineers, managers, and industry leaders. It focuses on current practices and emerging trends with practical takeaways.
Innatera Signs Joya as ODM Customer, Bringing Neuromorphic Edge AI into Everyday Connected Products
11/13/2025 | PRNewswireInnatera, the leader in brain-like neuromorphic computing for ultra-low-power intelligence at the sensor edge, today announced that Xiamen Joyatech Co., Ltd. has become its first Original Design Manufacturer (ODM) customer.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.
The Technical Backbone of an EMS Company: A CEO’s Perspective
11/13/2025 | Jay Rupani, Precision PCBAs the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.