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Real Time with… AltiumLive 2020: A Novel Idea—Design With Manufacturing
October 7, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Andy Shaughnessy speaks with Jeremie Waller, senior electrical engineer at Quantel USA, about the panel he’ll be participating in during AltiumLive 2020 on design with manufacturing. He and panelists Gerry Partida of Summit Interconnect and Greg Zhiraldo of Advanced Assembly will discuss why designers need to see their fabrication and assembly providers as true partners, not just customers, and why communication is such a vital part of the design process.
Visit Real Time with… AltiumLive 2020 to catch the latest video interviews and event-related content.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/29/2023 | Andy Shaughnessy, I-Connect007This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!
Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements
09/29/2023 | SiemensSiemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.
Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows
09/29/2023 | Cadence Design Systems, Inc.Cadence Design Systems, Inc. announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
09/28/2023 | TSMCTSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design for TSMC
09/28/2023 | Keysight Technologies, Inc.Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.