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Corelis Introduces New ScanExpress Version 9.8.0 Boundary-Scan Software SuiteOctober 21, 2020 | Corelis, Inc.
Estimated reading time: Less than a minute
Corelis, the leading supplier of high-performance boundary-scan test and measurement software and hardware, announced today version 9.8.0 of its ScanExpress™ Boundary-Scan Suite of Software is now available.
Improvements include: ScanExpress JET can now take advantage of optional ScanExpress JET Advanced Diagnostics for detailed memory test diagnostics with fully automated analysis. Processor-controlled functional test results are diagnosed down to the net-and-pin level, even on BGA components where physical debug and test access is limited.
ScanExpress JET Advanced Diagnostics integrate with ScanExpress Runner and Viewer to provide both a test log and visual representation of fault locations. The precise diagnostics are ideal for extensive testing of embedded systems in high-reliability products including avionics, telecommunications boards, automotive ECU systems, and more. Processor-specific memory tests include multiple memory standards including DDR, GDDR, and more. For supported CPU information, please contact Corelis sales.
Additionally, all ScanExpress software has been updated with the latest features and updated device support. Highlights include improved EDIF netlist support, new support for memory bank tests with mixed data bus widths, and support for larger flash devices.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.