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Intellitronix Buys Cutting-edge SMT Component Placement System
October 23, 2020 | Globe NewswireEstimated reading time: 1 minute
 
                                                                    Intellitronix Corporation, a wholly-owned subsidiary of the US Lighting Group, Inc.and a leading manufacturer of automotive electronics, announced it has purchased a state-of-the-art SMT Component Placement System from Europlacer (France). The Europlacer iineo+ Pick-and-Place platform is a fully automated, multi-functional robotics system with high-speed feedthrough of printed circuit boards (PCB) and precision electronics component placement capabilities.
“Procurement of the Europlacer system is a vital part of the company’s strategic plan of continuous growth to escalate production assembly to meet the increased demand for Intellitronix automotive electronics products. We are thrilled with the advanced technology this provides us in one platform. The Pick-and-Place system can process 30,000 electronics components per hour, handle larger circuit boards, boost production output threefold, and improve quality control with built-in electronics components testing resulting in higher electronics accuracy rates. Our pick-and-place assembly process uses a sizeable quantity of varied surface mounted electronics components, so we were also looking for a system with substantially greater precision placement capabilities,” said Paul Spivak, CEO of the US Lighting Group.
“On top of all these benefits, the Europlacer system gives us more flexibility to produce anything that we can design and engineer. The purchase of the Europlacer Pick-and-Place technology will bring additional benefits to the company, its customers, and shareholders. We are sincerely grateful to our shareholders for their continued support by purchasing restricted stock directly from the company giving us the ability to buy the Europlacer system.”
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    