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Best Student Poster: Drop Shock Reliability

05/29/2024 | Michelle Te, I-Connect007
Two Auburn University doctoral candidates authored a poster on drop shock performance of solder alloys in BGA assemblies that won Best Student Poster at IPC APEX EXPO 2024. They received a $750 cash prize and a $2,000 scholarship. Palash Vyas is a Ph.D. candidate in the Department of Industrial Engineering with more than three years of research experience in reliability testing of PCBs. His paper was co-authored by Soroosh Alavi, who has bachelor’s and master’s of science degrees in industrial engineering.

Chiplet Architecture for AI Will Create New Demands for Assembly

05/28/2024 | Nolan Johnson, SMT007 Magazine
As we look deeper into the entire AI ecosystem, it becomes clear that AI algorithms are intensely hungry for compute power. This demand for compute resources is accelerating beyond the customary rate predicted by Moore’s Law, just as traditional semiconductor fabrication methods are failing to maintain Moore’s Law. It’s a real dilemma.

Airbus to Establish Tech Hub in Japan

05/27/2024 | Airbus
Airbus has announced plans to establish a Tech Hub in Japan. The new initiative is designed to develop partnerships in the country to advance research, technology and innovation in aerospace and push boundaries to prepare for the next generation of aircraft.

TSMC Launches ‘Eco Plus! - Ecological Harmony Program’ to Enhance Green Conservation in Three Key Aspects

05/24/2024 | TSMC
As the challenge of climate change continues to grow, preserving ecosystems and natural environments has become a crucial part of achieving sustainable development.

Unique Look Behind the Scenes of AT&S Research

05/23/2024 | AT&S
The technology leader AT&S already holds almost 800 patents and is giving an insight into its R&D departments in Leoben at the “Long Night of Research” on May 24. But some things remain top secret: the new research center and Europe’s first substrate plant recently installed a high-tech machine that is unique in the world. It allows the exposure of substrate structures that are 14 times thinner than a human hair.
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